ADL5562ACPZ-R7

$15.00

ADL5562ACPZ-R7

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ADL5561ACPZ-R7/ADL5562ACPZ-R7 Low Noise Broadband Differential Amplifier IC LFCSP-16 for RF signal Chain Optimization Solution

  • ADL5561ACPZ-R7
    1. Product positioning: High-performance differential amplifier designed for radio frequency (RF) and intermediate frequency (IF) applications, suitable for driving 8-16-bit high-speed analog-to-digital converters (ADCs).2. Core parameters:
    ***Bandwidth: 2.0 GHz (at 6 dB gain)
    ***Gain options: 6 dB, 12 dB, 15.5 dB (pin configurable)
    ***Noise performance: Input noise as low as 2.1 nV/√Hz (at 12 dB gain)
    ***Power supply voltage: 2.8 V ~ 3.6 V
    ***Package: 16-lead LFCSP compact package3. Technical advantages:
    ***Low distortion: Maintain excellent harmonic distortion performance over a wide frequency range (e.g. HD2 < -90 dBc at 10 MHz).
    ***High flexibility: Gain adjustable to adapt to a variety of application scenarios.
    ***Wide temperature operation: Supports industrial temperature range of -40℃ to +85℃.

    4. Typical applications:
    ***Wireless communications (such as 5G base stations, modems)
    ***Instruments (signal acquisition, spectrum analysis)
    ***Audio equipment (high-end audio, live sound systems)
    ***Industrial control (sensor interface, automated testing)

  • ADL5562ACPZ-R7
    1. Product positioning: broadband, low-distortion differential amplifier optimized for RF/IF gain stages and differential ADC drivers.2. Core parameters:
    ***Bandwidth: 2.0 GHz (at 6 dB gain)
    ***Gain options: 6 dB, 12 dB, 15.5 dB (supports single-ended/differential input)
    ***Noise performance: Input noise 2.1 nV/√Hz (at 12 dB gain)
    ***Power supply voltage: 2.8 V ~ 3.6 V
    ***Package: 3 mm × 3 mm LFCSP-16 package3. Technical advantages:
    ***Ultra-low distortion: Third-order intermodulation distortion (IMD3) is as low as -91 dBc at 250 MHz.
    ***Single power supply design: Simplify the power supply circuit and reduce power consumption.
    ***High linearity: Support complex signal processing chains (such as radar, medical imaging).

    4. Typical applications:
    ***Broadband communication (such as satellite communication, microwave link)
    ***Radar system (signal amplification, pulse compression)
    ***Medical electronics (ultrasound imaging, CT scanning)
    ***Test and measurement (high-speed data acquisition, signal analysis)

  • Common points
    ***Process and reliability: All adopt the original high-speed SiGe process to ensure high-frequency performance and reliability.
    ***Design support: Provide detailed data manuals, reference circuits and simulation models to accelerate the development process.
    ***Packaging advantages: Compact LFCSP package, suitable for space-constrained high-density PCB design.With their low noise, high linearity and flexible gain configuration, these two amplifiers have become key signal chain components for wireless communications, precision instruments and high-speed data acquisition systems.

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